Advanced Broadband 2nd-Level-Interconnects for LTCC Multi-Chip-Modules
نویسندگان
چکیده
Abstract — In this paper highly integrated 2-Level interconnects for use in LTCC-Packages up to 50 GHz are presented. They are based on an advanced implementation of a surface mount interconnect referred to as Land-Grid-Array (LGA) and on Ball-Grid-Array (BGA) technology. The optimization process was supported by a quasi 2D inverse scattering technique in order to localize and reduce discontinuities in the signal propagation path. The optimized transitions were subject to various numerical studies to identify impacts of package mount displacements and tolerances in manufacturing. Finally, numerical results of a package-to-package path is shown.
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تاریخ انتشار 2005